Cubot KingKong 8 vs hisense A9 Pro

Resumen

Marca: Cubot; HiSense
Fecha de lanzamiento: octubre de 2023, hace 2 años y 7 meses; marzo de 2023, hace 3 años y 2 meses
AnTuTu: 224.235 Antutu v9 Overall performance better than 56% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Tamaño: 6.53"; 6.1"
Resolución: 720 x 1612 px HD+; 824 x 1648 px FHD
Tipo: LCD IPS; eInk E INK Carta 1200
Densidad: 401 ppi Very high density; 302 ppi High Density
Relación de aspecto: 20:9; 18:9
Características: Hole-punch Notch, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Water Drop Notch, Capacitive, Multi-touch, Frameless

Procesador: MediaTek MT8788V; Qualcomm Snapdragon 662
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Tipo de CPU: Octa-Core; Octa-Core
Proceso: 12 nm; 11 nm
Frecuencia: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Qualcomm Adreno 610
RAM: 6 GB; 8 GB
Tipo de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Resolución: 48 Mpx; 13 Mpx
Apertura: Unknow; Unknow
Tamaño de píxel: 0.80 µm; —
Flash: Triple LED; LED
Estabilización óptica: No; No
Cámara lenta: No, 30 fps; No, 30 fps
Características: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacidad: 256 GB; 256 GB
Ranura SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensiones: 80.2 mm 169.9 mm 20.0 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Peso: 382 g; 183 g
Materiales: Rugged Smartphone, Metal; Plastic
Colores: Black Red Green; Black
Resistencia al agua y polvo: IP68, IP69; —
Resistencia a caídas: Class A B C D E 270 drops without defects; —
Reparabilidad: Class A B C D E; —
Superficie útil: 76 %; 76 %

Sistema operativo: Android 13 Tiramisu Android 13; Android 12 Snow Cone Android 12
Servicios de Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.1
Perfiles Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funciones Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Funciones USB: Charging, OTG; Charging, OTG
Navegación: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)