Cubot KingKong ES 3 vs hotwav T7S

Resumen

Marca: Cubot; Hotwav
Fecha de lanzamiento: julio de 2025, hace 10 meses; enero de 2025, hace 1 años y 4 meses
AnTuTu: 225.000 Antutu v10 Overall performance better than 56% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Tamaño: 6.74"; 6.52"
Resolución: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densidad: 269 ppi Medium Density; 407 ppi Very high density
Relación de aspecto: 20:9; 21:9
Características: Water Drop Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Procesador: Unisoc Tiger T606; MediaTek MT8788V
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo de CPU: Octa-Core; Octa-Core
Proceso: 12 nm; 12 nm
Frecuencia: 1.6 GHz; 2 GHz
GPU: ARM Mali-G57; Mali-G72 MP3
RAM: 6 GB; 4 GB
Tipo de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Resolución: 48 Mpx; 21 Mpx
Apertura: Unknow; Unknow
Flash: Dual LED; LED
Estabilización óptica: No; No
Cámara lenta: No, 30 fps; No, 30 fps
Características: Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Capacidad: 256 GB; 128 GB
Ranura SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensiones: 78.3 mm 162.5 mm 13.3 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 284 g; 310 g
Materiales: Rugged Smartphone, Metal; Rugged Smartphone, Plastic , Faux leather
Colores: Black Orange; Black Green
Resistencia al agua y polvo: IP68, IP69; IP68, IP69 , MIL-STD-810H
Resistencia a caídas: Class A B C D E 90 drops without defects; Class A B C D E 270 drops without defects
Reparabilidad: Class A B C D E; Class A B C D E
Superficie útil: 73 %; 71 %

Sistema operativo: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Servicios de Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.0 LELow energy consumption
Perfiles Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funciones Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funciones USB: Charging, OTG; Charging, OTG
Navegación: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)