hisense A9 Pro vs hmd ARC

Resumen

Marca: HiSense; HMD
Fecha de lanzamiento: marzo de 2023, hace 3 años y 3 meses; diciembre de 2024, hace 1 años y 6 meses
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 154.110 Antutu v10 Overall performance better than 54% of devices

Tamaño: 6.1"; 6.52"
Resolución: 824 x 1648 px FHD; 576 x 1280 px LowRes
Tipo: eInk E INK Carta 1200; LCD IPS
Densidad: 302 ppi High Density; 215 ppi Medium Density
Relación de aspecto: 18:9; 20:9
Características: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), 70% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Procesador: Qualcomm Snapdragon 662; Spreadtrum Unisoc SC9863A
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
Tipo de CPU: Octa-Core; Octa-Core
Proceso: 11 nm; 28 nm
Frecuencia: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; PowerVR GE8322
RAM: 8 GB; 4 GB
64 bits: Yes; Yes

Resolución: 13 Mpx; 13 Mpx
Apertura: Unknow; ƒ/ 2.0
Flash: LED; Dual LED
Estabilización óptica: No; No
Cámara lenta: No, 30 fps; No, 30 fps
Características: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensiones: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.9 mm 166.4 mm 9.0 mm Print 3D Model
Peso: 183 g; 185 g
Materiales: Plastic; Plastic
Colores: Black; Black
Superficie útil: 76 %; 80 %
Resistencia al agua y polvo: —; IP54
Resistencia a caídas: —; Class A B C D E 270 drops without defects
Reparabilidad: —; Class A B C D E

Sistema operativo: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Servicios de Google: With Google Mobile Services; With Google Mobile Services
Actualizaciones: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2
Perfiles Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Funciones Wi-Fi: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Funciones USB: Charging, OTG; Charging, OTG
Navegación: GPS, A-GPS; GPS, A-GPS, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)