hisense A9 Pro vs hotwav Cyber X

Resumen

Marca: HiSense; Hotwav
Fecha de lanzamiento: marzo de 2023, hace 3 años y 2 meses; julio de 2023, hace 2 años y 10 meses
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Tamaño: 6.1"; 6.78"
Resolución: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Tipo: eInk E INK Carta 1200; LCD IPS
Densidad: 302 ppi High Density; 396 ppi High Density
Relación de aspecto: 18:9; 21:9
Características: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Procesador: Qualcomm Snapdragon 662; MediaTek Helio G99 (MT6789)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Tipo de CPU: Octa-Core; Octa-Core
Proceso: 11 nm; 6 nm
Frecuencia: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MC2
RAM: 8 GB; 8 GB
64 bits: Yes; Yes
Tipo de RAM: —; LPDDR4X RAM

Resolución: 13 Mpx; 64 Mpx
Apertura: Unknow; Unknow
Flash: LED; Dual LED
Estabilización óptica: No; No
Cámara lenta: No, 30 fps; No, 30 fps
Características: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX686 Exmor RS
Tamaño de píxel: —; 0.80 µm
Tamaño del sensor: —; 1/1.7"

Capacidad: 256 GB; 256 GB
Ranura SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensiones: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 85.1 mm 181.8 mm 17.5 mm Print 3D Model
Peso: 183 g; 380 g
Materiales: Plastic; TPU , Rugged Smartphone
Colores: Black; Black
Superficie útil: 76 %; 70 %
Resistencia al agua y polvo: —; IP68, MIL-STD-810G , IP69

Sistema operativo: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Servicios de Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0
Perfiles Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funciones Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funciones USB: Charging, OTG; Charging, OTG
Navegación: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)