Honor X5 Plus vs hotwav T7S

Resumen

Marca: Honor; Hotwav
Fecha de lanzamiento: octubre de 2023, hace 2 años y 8 meses; enero de 2025, hace 1 años y 5 meses
AnTuTu: 127.000 Antutu v9 Overall performance better than 53% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Tamaño: 6.56"; 6.52"
Resolución: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densidad: 269 ppi Medium Density; 407 ppi Very high density
Relación de aspecto: 20:9; 21:9
Características: Water Drop Notch, Refresh rate 90 Hz, TÜV Rheinland Eye Comfort Certification, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Resolución: 50 Mpx; 21 Mpx
Apertura: ƒ/ 1.8; Unknow
Flash: LED; LED
Estabilización óptica: No; No
Cámara lenta: No, 30 fps; No, 30 fps
Características: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Capacidad: 5200 mAh; 6280 mAh
Tipo: Li-Polymer; Li-Polymer
Carga rápida: Yes , 10.0W; Yes , 15.0W
Características: Reverse charging, Non-removable; Reverse charging, Non-removable
Ciclos de carga: —; 1100 cycles
Autonomía: —; ~ 48h

Capacidad: 64 GB; 128 GB
Ranura SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensiones: 75.1 mm 163.3 mm 8.4 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 188 g; 310 g
Materiales: Plastic; Rugged Smartphone, Plastic , Faux leather
Colores: Black Cyan Green; Black Green
Superficie útil: 84 %; 71 %
Resistencia al agua y polvo: —; IP68, IP69 , MIL-STD-810H
Resistencia a caídas: —; Class A B C D E 270 drops without defects
Reparabilidad: —; Class A B C D E

Sistema operativo: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Servicios de Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Perfiles Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funciones Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funciones USB: Charging, OTG; Charging, OTG
Navegación: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)